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MC74VHC1G01 Single 2-Input NAND Gate with Open Drain Output
The MC74VHC1G01 is an advanced high speed CMOS 2-input NAND gate with an open drain output fabricated with silicon gate CMOS technology. The internal circuit is composed of multiple stages, including an open drain output which provides the ability to set output switching level. This allows the MC74VHC1G01 to be used to interface 5.0 V circuits to circuits of any voltage between VCC and 7.0 V using an external resistor and power supply. The MC74VHC1G01 input structure provides protection when voltages up to 7.0 V are applied, regardless of the supply voltage.
Features http://onsemi.com MARKING DIAGRAMS
SC-88A / SOT-353 / SC-70 DF SUFFIX CASE 419A
V0 M G G
* * * * * *
High Speed: tPD = 3.7 ns (Typ) at VCC = 5.0 V Low Internal Power Dissipation: ICC = 1 mA (Max) at TA = 25C Power Down Protection Provided on Inputs Pin and Function Compatible with Other Standard Logic Families Chip Complexity: FETs = 62 Pb-Free Packages are Available
TSOP-5 / SOT-23 / SC-59 DT SUFFIX CASE 483 V0AYW G
IN B
1 OVT
5
VCC
M = Date Code A = Assembly Location Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
PIN ASSIGNMENT
1 2 IN B IN A GND OUT Y VCC
IN A
2
GND
3
3 4 OUT Y 4 5
Figure 1. Pinout (Top View)
FUNCTION TABLE
Inputs A B L H L H Output Y Z Z Z L
IN A IN B
&
OUT Y
Figure 2. Logic Symbol
L L H H
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2005
1
June, 2005 - Rev. 14
Publication Order Number: MC74VHC1G01/D
MC74VHC1G01
MAXIMUM RATINGS
Symbol VCC VIN VOUT IIK IOK IOUT ICC TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current, per Pin DC Supply Current, VCC and GND Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance Power Dissipation in Still Air at 85C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Above VCC and Below GND at 125C (Note 5) SC70-5/SC-88A (Note 1) TSOP-5 SC70-5/SC-88A TSOP-5 VOUT t GND; VOUT u VCC Parameter Value *0.5 to )7.0 -0.5 to +7.0 *0.5 to VCC )0.5 -20 $20 25 $25 *65 to )150 260 )150 350 230 150 200 Level 1 UL 94 V-0 @ 0.125 in u2000 u200 N/A $500 V Unit V V V mA mA mA mA C C C C/W mW
ILATCHUP
Latchup Performance
mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN VOUT TA tr , tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V Characteristics Min 2.0 0.0 0.0 -55 0 0 Max 5.5 5.5 7.0 +125 100 20 Unit V V V C ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES
Junction Temperature C 80 90 100 110 120 130 140 NORMALIZED FAILURE RATE Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130C TJ = 120C TJ = 100C TJ = 110C TJ = 90C TJ = 80C 100 TIME, YEARS
1 1 10 1000
Figure 3. Failure Rate vs. Time Junction Temperature
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MC74VHC1G01
DC ELECTRICAL CHARACTERISTICS
VCC Symbol VIH Parameter Minimum High-Level Input Voltage Test Conditions (V) 2.0 3.0 4.5 5.5 2.0 3.0 4.5 5.5 VIN = VIH or VIL IOL = 50 mA VIN = VIH or VIL IOL = 4 mA IOL = 8 mA ILKG IIN ICC IOFF Z-State Output Leakage Current Maximum Input Leakage Current Maximum Quiescent Supply Current Power Off-Output Leakage Current VIN = VIL VOUT = VCC or GND VIN = 5.5 V or GND VIN = VCC or GND VOUT = 5.5 V VIN = 5.5 V 2.0 3.0 4.5 3.0 4.5 5.5 0 to 5.5 5.5 0 0.0 0.0 0.0 Min 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 0.1 0.1 0.1 0.36 0.36 $5 $0.1 1.0 0.25 TA = 255C Typ Max TA v 855C Min 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 0.1 0.1 0.1 0.44 0.44 $10 $1.0 20 2.5 Max *555C v TA v 1255C Min 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 0.1 0.1 0.1 0.52 0.52 $10 $1.0 40 5 mA mA mA mA Max Unit V
VIL
Maximum Low-Level Input Voltage
V
VOL
Maximum Low-Level Output Voltage VIN = VIH or VIL
V
I I IIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII IIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII IIIIIII I I I IIIII I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII IIIII I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIII I I IIIIIIIIII IIIII I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIII I I I I I I IIIIIII IIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIII I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
TA = 25C Typ 5.5 8.0 3.7 5.2 8.0 5.2 4 TA 85C -55 TA 125C Min Max Symbol Parameter Test Conditions Min Max 7.9 11.4 5.5 7.5 Min Max Unit ns tPZL Maximum Output Enable Time, Input A or B to Y VCC = 3.3 0.3 V CL = 15 pF RL = RI = 500 W CL = 50 pF VCC = 5.0 0.5 V CL = 15 pF RL = RI = 500 W CL = 50 pF VCC = 3.3 0.3 V CL = 50 pF RL = RI = 500 W VCC = 5.0 0.5 V CL = 50 pF RL = RI = 500 W 9.5 13.0 6.5 8.5 11.0 15.5 8.0 10.0 15.5 10.0 10 tPLZ Maximum Output Disable Time 11.4 7.5 10 13.0 8.5 10 ns CIN Maximum Input Capacitance pF Typical @ 25C, VCC = 5.0V 18 CPD Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
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MC74VHC1G01
VCC A B Y 50% VCC OVT VCC - 7 V RL A or B 50% GND tPZL tPLZ HIGH IMPEDANCE VOL +0.3 V VCC
Figure 4. Output Voltage Mismatch Application
Figure 5. Switching Waveforms
VCC VCC x 2
PULSE GENERATOR RT
R1 DUT CL RL
CL = 50 pF equivalent (Includes jig and probe capacitance) RL = R1 = 500 W or equivalent RT = ZOUT of pulse generator (typically 50 W)
Figure 6. Test Circuit
MC74VHC1G01 A B MC74VHC1G03 C D
VCC 1 2 3 4 5
VCC 2.2 kW B A E = (A * B) + (C+D)
VCC
MC74VHC1G01 1.5 V 3.3 V 220 W
R LED
A B
GTL
Figure 7. Complex Boolean Functions
Figure 8. LED Driver
Figure 9. GTL Driver
DEVICE ORDERING INFORMATION
Device Order Number MC74VHC1G01DFT1 MC74VHC1G01DFT1G MC74VHC1G01DFT2 MC74VHC1G01DFT2G MC74VHC1G01DTT1 MC74VHC1G01DTT1G Package Type SC70-5 / SC-88A / SOT-353 SC70-5 / SC-88A / SOT-353 (Pb-Free) SC70-5 / SC-88A / SOT-353 SC70-5 / SC-88A / SOT-353 (Pb-Free) SOT23-5 / TSSOP-5 / SC59-5 SOT23-5 / TSSOP-5 / SC59-5 (Pb-Free) Tape and Reel Size 178 mm (7") 3000 Unit 178 mm (7") 3000 Unit 178 mm (7") 3000 Unit 178 mm (7") 3000 Unit 178 mm (7") 3000 Unit 178 mm (7") 3000 Unit
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC74VHC1G01
PACKAGE DIMENSIONS
SC-88A/SOT-353/SC-70 CASE 419A-02 ISSUE H
A G
5
4
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
S
1 2 3
-B-
DIM A B C D G H J K N S
D 5 PL
0.2 (0.008)
M
B
M
N J C
INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087
MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
H
K
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025 0.40 0.0157
1.9 0.0748
SCALE 20:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74VHC1G01
PACKAGE DIMENSIONS
TSOP-5/SOT-23/SC-59 CASE 483-02 ISSUE D
D
5 1 2 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181
S
B
L G A J C 0.05 (0.002) H K M
DIM A B C D G H J K L M S
SOLDERING FOOTPRINT*
1.9 0.074
0.95 0.037
2.4 0.094 1.0 0.039 0.7 0.028
SCALE 10:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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PUBLICATION ORDERING INFORMATION
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MC74VHC1G01/D

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